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Projects

Rapidon automated substrate thickness measurement system high-precision sensor handling solution.

Subtrate Thickness Measurement System

Automated system for precise substrate thickness measurement

Industry

Semiconductor Manufacturing

Timeline

9 months

Result

reliable measurements, high test throughput

Rapidon manual wafer batch split tool SEMI E47 FOUP transfer one-handed operation.

Wafer Batch Split Tool

Manual wafer batch split tool

Industry

Semiconductor Manufacturing

Timeline

3 months

Result

precise, reliable wafer batch transfer

Rapidon automated shore hardness measurement durometer module integration compact in-line solution.

Automated Shore Hardness Measurement

Development and Integration of durometer module for automated shore hardness measurement

Industry

Semiconductor Manufacturing

Timeline

4 months

Result

automated in-line shore hardness measurement

Rapidon high-precision custom engineering project collaboration and agile development framework.

Your Custom Engineering Project

We are currently defining the specifications for our next showcase. This slot is reserved for a complex technical solution. Share your current challenges, and start collaborating with our team to define the next project shown here.

Let's Build Something Exceptional

Ready to transform your automation challenges into competitive advantages? Get in touch with our engineering team to discuss your project requirements.

+49 (0) 351 82616707

info@rapidon.de

Karlsruher Straße 8, 01189 Dresden, Germany

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